Chairman's New Year Address | Strategic Determination, Strengthening the Foundation and Cultivating Vitality - A Happy Journey

Dragon dances, auspicious clouds bid farewell to the old year, and the snake carries auspicious energy to welcome the new spring. On the occasion of the upcoming Spring Festival, on behalf of LINGYI iTECH (GUANGDONG) COMPANY, I would like to express my sincere gratitude and best wishes to our customers who have always trusted and supported LINGYI iTECH (GUANGDONG) COMPANY, to all LY employees and their families who have fought side by side with us, and to the investors and friends from all walks of life who have given us long-term support!

2025-01-28

LINGYI iTECH (GUANGDONG) COMPANY joins AMD's core supply chain: Entering the graphics card market, from design to manufacturing, achieving a global layout

LINGYI iTECH (GUANGDONG) COMPANY, with its superior technological strength and global vision, has steadily expanded its product lines and business groups, successfully becoming a core supplier to AMD. It collaborates on various product series projects and is a significant driver in the high-performance cooling field.

2025-01-26

Lingpeng Intelligent, a subsidiary of LINGYI iTECH (GUANGDONG) COMPANY, wins the Excellence Award at the 2nd Special Robot Industry Chain "Challenge" event

Recently, Shenzhen Lingpeng Intelligent Technology Co., Ltd. (hereinafter referred to as "Lingpeng Intelligent"), a subsidiary of LINGYI iTECH (GUANGDONG) COMPANY, won the Outstanding Unit Award in the second Special Robot Industry Chain "Challenge" Promotion Activity for its technological breakthroughs in "high-voltage, high-power servo drive systems". This activity was jointly organized by the Ministry of Industry and Information Technology, the State-owned Assets Supervision and Administration Commission of the State Council, the Shenzhen Municipal People's Government, and other departments.

2025-01-22

LINGYI iTECH (GUANGDONG) COMPANY's MSCI ESG rating receives A rating again, continuing to lead the new heights of sustainable development

2025-01-20

LINGYI iTECH (GUANGDONG) COMPANY partners with Brembo, a global leader in braking systems

Recently, LINGYI iTECH (GUANGDONG) COMPANY has leveraged its technological advantages in precision manufacturing and intelligent manufacturing to actively promote comprehensive cooperation with Brembo. Both parties will jointly explore future development paths for braking systems.

2025-01-17

LINGYI iTECH (GUANGDONG) COMPANY wins "Best Disclosure Award" and "Best ESG Award" at the 8th China Excellent IR Selection

Recently, at the "Roadshow China" 2025 Listed Company Investor Relations Innovation Summit and the 8th China Excellent IR Awards Ceremony, LINGYI iTECH (GUANGDONG) COMPANY won two major awards: "Best Information Disclosure Award" and "Best ESG Award." This also marks LINGYI iTECH (GUANGDONG) COMPANY's fourth consecutive win of the "Best ESG Award."

2025-01-09

Setting sail! LINGYI iTECH (GUANGDONG) COMPANY's high-power products achieve mass overseas delivery

Recently, LINGYI iTECH (GUANGDONG) COMPANY's kilowatt-level high-power power supply cabinet products have been officially delivered in batches overseas. This delivery mainly includes the Lotus Power Cabinet (LPC) and the Lotus Telemetry Cabinet (LTC), delivered to Ohmium International, Inc. (hereinafter referred to as "Ohmium"), a green hydrogen energy company.

2024-12-24

LINGYI iTECH (GUANGDONG) COMPANY wins the "2024 Outstanding Listed Company" award

The Southern Finance International Forum 2024, hosted by Southern Finance Media Group and undertaken by the 21st Century Business Herald, was held in Guangzhou on December 12.

2024-12-14

Good News | LINGYI iTECH (GUANGDONG) COMPANY Wins Xiaomi's Best Partner Award

Recently, LINGYI iTECH (GUANGDONG) COMPANY won the "Best Partner" award at the "2024 Xiaomi Core Supplier Conference".

2024-12-09

Beyond 3D VC——LINGYI iTECH (GUANGDONG) COMPANY showcased its high-end heat dissipation product Big MAC

Recently, LINGYI iTECH (GUANGDONG) COMPANY was invited to participate in the "2024 China AI Chip Developer Forum." Organized by Cheqian Information & Thermal Design Network and co-organized by Shenzhen Industrial Exhibition Association, the forum focused on discussions regarding high-computing AI chip development, chip interconnection technology, chip thermal design, chip packaging and testing technology, and high-efficiency chip heat dissipation technology.

2024-12-07